Thermal Interface Materials Market Report 2020, Industry Trends, Size, Share and Forecast till 2025 – IMARC Group

The global thermal interface materials market grew at a CAGR of around 12% during 2014-2019. Looking forward, the market is expected to continue its moderate growth during the next five years., according to a new report by IMARC Group.

Thermal interface materials (TIMs) are inserted between mechanically mated surfaces to enhance heat transmission. The different types of TIMs include gap filler pads, graphite films, phase-change materials, thermally conductive fabrics, green heat-conducting sponges, etc. They reduce thermal resistance and bring the electronic device to an ambient temperature, thereby ensuring optimum functionality. Due to their exceptional thermal conductive properties, TIMs are widely used in the manufacturing of semiconductor packaging, consumer electronics, power devices, automobile components, etc.

Market Trends

Rapid industrialization, coupled with the surging demand for consumer electronics, is catalyzing the market for TIMs across the globe. To ensure sustainability, several automotive manufacturers are integrating TIMs with stereo systems and interior automation components, thereby reducing greenhouse gas (GHG) emissions. Additionally, the TIM market is further augmented by its rising utilization in manufacturing of compact and energy-efficient LEDs for both residential and industrial purposes.

Moreover, various technological advancements have led to the rapid integration of electronic devices with Internet of Things (IoT), thereby bolstering the market growth. Apart from this, the prevalent trend of miniaturization and development of multi-functional TIMs is anticipated to further drive the product demand.

Note: We are regularly tracking the direct effect of COVID-19 on the market, along with the indirect influence of associated industries. These observations will be integrated into the report.

Thermal Interface Materials Market 2020-2025 Analysis and Segmentation:

Competitive Landscape:

The competitive landscape of the market has been studied in the report with the detailed profiles of the key players operating in the market.

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Some of the key players operating in the market which include 3M Company (NYSE: MMM), Dow Inc., Henkel AG & Co. KGaA (OTCMKTS: HENKY), Honeywell International Inc., Indium Corporation, Kitagawa Industries America Inc., Laird Technologies Inc. Momentive Performance Materials Inc., Parker-Hannifin Corporation, Zalman Tech Co. Ltd., etc.

The report has segmented the market on the basis of Product Type, Application, and Region.

Breakup by Product Type:

Tapes and Films
Elastomeric Pads
Greases and Adhesives
Phase Change Materials
Metal Based Materials
Others

Breakup by Application:

Telecom
Computer
Medical Devices
Industrial Machinery
Consumer Durables
Automotive Electronics
Others

Market Breakup by Region

North America
Asia Pacific
Europe
Latin America
Middle East and Africa

Key highlights of the report:

Market Performance
Market Outlook
Porter’s Five Forces Analysis
Market Drivers and Success Factors
SWOT Analysis
Value Chain
Competitive Structure
Profiles of Key Players

For more information about this report: https://www.imarcgroup.com/thermal-interface-material-market

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