Lucintel’s latest market report analyzed that high-density interconnect (HDI) PCB provides attractive opportunities in the smartphone, computer, telecom and datacom, consumer electronics, and automotive industries. The high-density interconnect (HDI) PCB market is expected to reach $19.1 billion by 2027 with a CAGR of 4.7%. In this market, 4-6 layers is the largest segment by technology, whereas smartphones is largest by end use industry. Miniaturization of electronic devices and growing demand for low loss/high-speed HDI PCBs provides strategic growth path in this market.
Download Brochure of this report by clicking on https://www.lucintel.com/high-density-interconnect-printed-circuit-board-market.aspx Based on technology, the high-density interconnect (HDI) PCB market is segmented into 4-6 layer, 8-10 layer, and 10+ layer. The 4-6 layers segment accounted for the largest share of the market in 2021 and is expected to register the highest CAGR during the forecast period, due to increasing demand in smartphones and telecommunication equipment.
Browse in-depth TOC on “High-Density Interconnect (HDI) PCB Market”
76 – Tables
99 – Figures
195 – Pages
The High-Density Interconnect (HDI) PCB Market is marked by the presence of several big and small players. Some of the prominent players offering high-density interconnect (HDI) PCB include TTM Technologies, Inc., Tripod Technology Corporation, AT&S, Kingboard Holdings Ltd., CCTC, DG Shengyi Electronics, Dynamic Electronics Co. Ltd., Gold Circuit Electronics, Olympic, DAP, Unimicron Technology Corp.,Compeq Manufacturing Co., Ltd., Ibiden Co., Ltd., Zhen Ding Technology Holding Limited, Unitech, Samsung Electro-Mechanics, and Meiko Electronics Co. Ltd.
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