Advanced IC Packaging Market is expected to reach $52.3 Billion by 2027 – An exclusive market research report by Lucintel 1
Trends and Forecast for the Global Advanced IC Packaging Market
Trends, opportunities and forecast in advanced IC packaging market to 2027 by packaging type (flip-chip, fan-in wafer level packaging, embedded-die, fan-out, 2.5D/3D) end use industry (consumer and communication, automotive, industrial, healthcare, aerospace and defense, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)

Lucintel’s latest market report analyzed that advanced IC packaging provides attractive opportunities in the consumer & communication, automotive, industrial, healthcare, and aerospace & defense industries. The advanced IC packaging market is expected to reach $52.3 billion by 2027 with a CAGR of 5.7%. In this market, flip-chip is the largest segment by packaging type, whereas consumer and communication is largest by end use industry. Development of packaging solutions for AI and IoT and introduction of new IC packaging technologies, such as fan out and 2.5D/3D provides strategic growth path in this market.

Download Brochure of this report by clicking on https://www.lucintel.com/advanced-packaging-market.aspx Based on packaging type, the advanced IC packaging market is segmented into flip-chip, fan-in wafer level packaging, embedded-die, fan-out, 2.5D/3D. The flip-chip segment accounted for the largest share of the market in 2021 and is expected to register the highest CAGR during the forecast period, due to rise in demand for high speed portable devices and high packaging density.

Browse in-depth TOC on “Advanced IC Packaging Market”

68 – Tables

107 – Figures

205 – Pages

The Advanced IC packaging Market is marked by the presence of several big and small players. Some of the prominent players offering advanced IC packaging include Amkor Technology, Taiwan Semiconductor, Advanced Semiconductor Engineering Technology, Intel Corporation, Samsung Electronics, JCET Group, Texas Instruments, Toshiba Corporation, and Renesas.

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https://www.lucintel.com/advanced-packaging-market.aspx

This unique research report will enable you to make confident business decisions in this globally competitive marketplace. For a detailed table of contents, contact Lucintel at +1-972-636-5056 or click on this link helpdesk@lucintel.com.

About Lucintel

Lucintel, the premier global management consulting and market research firm, creates winning strategies for growth. It offers market assessments, competitive analysis, opportunity analysis, growth consulting, M&A, and due diligence services to executives and key decision-makers in a variety of industries. For further information, visit www.lucintel.com.

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